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Products |
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| Geringer Halbleitertechnik is a leading manufacturer of innovative production equipment for the
global semiconductor
industry, concentrating on four business areas: |
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Models |
Multi Chip Die Bonders |
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| Geringer offers a wide range of flexible fully-automatic high-precision large area die bonders for the most complex
applications for the fields of multi chip module production, RFIC, laser devices, SAW filters, MEMS, sensors, flip chip,
COB, stacked dice, etc. for the auto-mobile industry, medical technology, aerospace technology and and opto-electronics
module manufacturing. |
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Micro Assembly |
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In addition to the die bonders Geringer offers automatic ultra-high precision micro-assembly systems with an accuracy
better than 1μm for laser devices and opto-electronics module manufacturing. |
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Front-End Systems |
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| Geringer offers an extensive array of products for wafer processing: Manual handling, semi-automatic machines or fully
automated equipment using wafer robots. |
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Backend Systems |
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| Geringer's backend systems are designed to test and package finished semiconductor- and optoelectronic devices at
high speed and with unprecedented accuracy. The systems are available as integrated backend processing systems or
as stand alone systems. |
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Special Equipment |
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| Coming soon. |
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