News & Events |
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Geringer Halbleitertechnik at trade fairs & exhibitions 2012 |
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| We look forward to wellcoming you at the following trade fairs: | ||||||||||||||||||||||
SEMICON China 2012 |
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| March 20-22, 2012 Shanghai New International Expo Centre Shanghai China Booth #4343 |
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SMT Hybrid Packaging 2012May 08-10, 2012 Booth #7-325 |
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SEMICON West 2012July 10-12, 2012 |
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Geringer acquires former Siemens die bonder business unit from CMTec AG (Switzerland) |
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Effective September 1, 2011, Geringer Halbleitertechnik GmbH & Co. KG have acquired the former Siemens die bonder activities from CMTec AG (Switzerland). We will evolve the multi chip multi placement die bonders of the A-Series and make them a central part of our product portfolio. Our knowledge and experience in the die bonding field, gained over a period of over 15 years, paired with the technology of A-Series die bonders, provide the perfect combination to develop and market innovative and advanced die bonders by means of synergy effects in your interest. The approximate 100 ASeries customers (and Delvotec 4300/4400/450x customers), with more than 200 installations worldwide, will continue to receive the service and support they need and are accustomed to through our worldwide sales and service representative network. |
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Geringer goes global |
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Geringer Halbleitertechnik has extended its global presence and already today all important markets and regions are covered and served by a worldwide sale and service network. It is our endeavor that our global customers have local contact persons in sales matters and can rely on fast on-site service by competent technicians. The new sales organization is headed by Mr. Hermann Moos (sales@geringer.de), a veteran with nearly 20 years of sales and marketing experience in the semiconductor capital equipment industry. Mr. Moos will be happy to answer your questions.
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