• About us
  • History
  • Chronology
• Products
  • Frontend
    • Wafer Processing and Sorting
    • Wafer Coating
    • Wafer Laminating
    • Frame Mounter
    • Wafer Detaping
    • Wafer Expanding
  • Backend
    • Testhandler
    • Taping Systems
    • Laserdeflashing Machines
    • Reel to Reel Linking
  • Microassembly
    • Universal Bonder
    • FA-OPUF
    • LJA
    • DBA
    • SA-OPUF
  • Special Equipment
• Service
• Quality
• Contact
  • How to find us
• References
  • Cooperations

Fully automatic high-precision die-bonding equipment MMA100

The base system allows high-precision active or passive mounting of arbitrary workpieces. The system is designed to meet the needs for assembly of micro-optical components, where active mounting means that the alignment process is driven by some kind of measurement like laser power or laser beam analysis.
The systems economical focus is on the transition from lab research and process development to full-time, fully-automatic high-volume production. All processes can be developed and researched on the equipment.Typical applications are fiber mounting, adjustment of lenses in micro-scale laser or resonator designs.

more...