Chronology |
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2011 |
- Geringer Halbleitertechnik acquired the former Siemens and Delvotec die bonder business from CMTec AG and goes global with sales and service representatives in all major markets and regions.
- Celebration of 20th company anniversary.
|
2010 |
- Geringer Halbleitertechnik develop tri-temp test handler for Hall sensors and expands font-end equipment unit by adding innovative equipment for LED production.
|
2009 |
- Geringer Halbleitertechnik cope with world economic crisis without layoffs and home in on promising new developments.
|
2008 |
- Move in new headquarter
- Geringer designes testhandler for solar modules
- Geringer achieves big purchase orders for tethandlers in all sectors
- Further staff expansion
|
2007 |
- Geringer designes an new generation of testhandlers for -40°C applications
|
2006 |
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Capacity for test handler production is extended
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Development of fully automatic laser lift off machine for separating bonded wafers
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Development of new front end equipment
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Geringer is a founding member of Regensburg Sensorik eV, a network for sensor technology, together with Siemens, Infineon, Krones, Epcos and others
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New jobs created in production and assembly
|
2005 |
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Geringer enters development partnership with Osram Opto Semiconductors GmbH for work on high power laser diode microassembly technology
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Geringer is honoured by the mayor of Barbing and other local politicians as one of the outstanding companies in the Regensburg region
- Geringer receives major contract for test handlers for Hall sensors
|
2004 |
|
2003 |
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Geringer receives Infineon Technologies environment award for laser deflashing equipment
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Geringer joins strategic partnership Regensburg Sensorik
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Geringer becomes a member of Bayern Photonics
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Geringer develops and patents a wholly new kind of taping machine for LEDs
- Development of singulation and taping machine
|
2002 |
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Expansion of front end division and introduction of several innovations
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Several patents related to back end production
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Development of equipment for optical mouse assembly
|
2001 |
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Reorganisation of company structure: Geringer becomes a GmbH & Co KG (limited partnership with a private limited company as a gerneral partner)
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Expansion of mechanical engineering development and creation of software and electronics departments
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Microassembly-related patents
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Production of several semi and fully automatic microassembly units for CD reader heads
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Geringer workforce now totals 40
|
2000 |
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Geringer receives major order for production of test handlers for LEDs from Infineon
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Back end division is extended
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Patent for breaking ceramic modules
|
1999 |
|
1998 |
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Expansion of capacity for microassembly die bonder manufacture
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Geringer manufactures the world's first ever fully automated equipment for producing transmitter/receiver modules for optic fiber technology
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Development of laser deflashing machines
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Production of test handler for magnetic field sensors
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ISO 9001 certification
|
1997 |
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Move to new production facility in Barbing
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Production of solder bonders for automotive applications
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Development of test handlers for magnetic field sensors
|
1996 |
- Development of die bonders for microassembly
- Patent for high precision microassembly equipment
|
1995 |
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Construction of new facility for assembly and lathe, drill and milling workshop in Barbing
near Regensburg
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Development of solder bonder for air mass measurement
|
1994 |
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Move to new premises
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CAD department founded
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Geringer enters development partnership with Siemens AG for semiconductors
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Development of semi-automatic inspection stations for microchips
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Manufacture of linking modules and buffers for reel to reel lines
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1993 |
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1992 |
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1991 |
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