Special Equipment

 

 

 

 
Dual Head Soldering Bonder for Chip Sensors
 
 
Single Head Soldering Bonder for Chip Sensors
 
 

 
In-Line Inspection Station
 

 
Taping Unit
 
 
 
Handling of Green-Tapes
 
Fracture of Ceramics Substrates to Single Modules
 
 
Semi automatic machine for odd-form-components
 
Mold Inspection/Singulation Machine for MiniSMDs
 

 

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