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Geringer Micron plus |
Automatic Die Bonding System with
Highest Accuracy, Flexibility and Speed |
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The Geringer Micronplus is an
automatic dual-gantry platform
die bonding system. It is the
ideal solution for complex
applications requiring highest
accuracy, flexibility and speed.
Epoxy deposition and
placement of different types of
dies can be realized in a single
pass on substrates up to 10.5" x 6" (265mm x 150 mm).
Flexible die input from wafer,
waffle or gel pack as well as a
wide range of customized
solutions for the automatic
handling of substrates, boats,
or lead frames make the
Geringer Micronplus the die
bonder of your choice. |
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Features:
- 2 independent X-Y gantry stations,
- epoxy station: stamping and / or dispensing (can also be used for glob-top)
- pick&place station: pick&place dies from wafer, gel- or waffle-pack
with positional and rotational die placement corrections
- Placement accuracy: ± 3μm ~ ± 5μm at 3 s (target - material dependent)
- Flexible die presentation: wafer frames, hoop rings, waffle packs or gel packs,
no restriction on type & mix
- walking beam indexer, belt conveyor system, reel to reel system magazine
loader / unloader available for
fully automatic production
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| Contact us for more details |
