|
||
| With the Geringer A-Series, customer requirements for flexibility and accuracy in electronics module manufacturing, the automobile industry, medical technology and aerospace technology manufacturing can be achieved better than before. | ||
Geringer A1Flexible Epoxy and Eutectic Placement with Highest Accuracy |
||
 |
The A1 is a fully automatic
single-gantry platform for highly complex applications. It is used alternately to deposit epoxy and place dies in a single pass over a large bond area up to approx. 25" x 6" (640mm x 150mm). Over 200 different dies presented either from wafer, waffle or gel packs and up to 5 different SMD components from tape feeders ensures fast, accurate and flexible performance for the most complex processes. Eutectic and standard epoxy die bonding can be performed in the same machine. Additionally a wide range of customized handling systems for substrates, PCBs, boats, carriers, modules and leadframes is available. |
 |
 |
||
Geringer A2Die Attach- and Flip Chip Bonding with Maximum Flexibility and Accuracy |
||
 |
The fully automatic model A2,
a dual-gantry platform, is the
ideal solution for complex
applications. Epoxy deposition
and placement of more than
200 different types of dies can
be realized in a single pass on
substrates up to 10.5" x 6" (265mm x 150 mm). Flexible
die input from wafer, waffle or
gel pack as well as a wide
range of customized solutions
for the automatic handling of substrates, boats, single packages or lead frames make the A2 the die-bonder of your choice. |
 |
 |
||
