Geringer Halbleitertechnik GmbH & Co. KG, headquartered in Barbing near Regensburg, is a leading manufacturer of innovative production equipment for the global semiconductor industry. Geringer's product range includes leading edge flexible high precision multi chip die bonders for the most complex applications, ultra-high precision micro assembly systems with an accuracy better than 1μm, fully-automatic front-end systems to process single wafers and integrated back-end systems to test and package finished semiconductor- and optoelectronic devices at high speed and with unprecedented accuracy.
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